SATELLITE 2018 (March 12-15)
Walter E. Washington Convention Center, Washington, D.C
Join Us at Booth #644
Further your knowledge of thermal testing and process cooling for satellite communications and space technology. With forward-looking keynotes and in-depth conference sessions, this event explores the latest innovations and steps forward in building the future of connectivity.
OFC2018 (March 13-15)
San Diego Convention Center
Join Us at Booth #5916
Talk to us about transceiver temperature testing and optical component thermal characterization. The Optical Fiber Communication Conference and Exhibition (OFC) is the largest global conference and exhibition for the optical communications and networking industry. We will be exhibiting our Temptronic ThermoStream® and ThermoSpot® systems, and Sigma Systems thermal plates and thermal chambers
When to assess quality and reliability test resources
Thermal chambers have found a place in the psyche of test, quality, and production engineers - and for good reason. They can be an ideal test environment when precisely matched to the test specifications. However, often times they are not.
pros and cons of cryogenic vs. compressor-based cooling
Deciding between a cryogenic and compressor-based cooling engine for your thermal chamber or thermal platform can be difficult. Download this application note to better understand the advantages of each cooling engine and to help decide which one best fits your application.
For high flow thermal conditioning of electronic modules
This bench top system is ideal for conditioning electronics with high volume, low pressure, temperature controlled air. The system delivers up to 43scfm of precisely controlled, clean dry air for conditioning components and instrumentation. It is capable of cycling and holding at temperatures from 20 to 70°C.
These thermal systems provide precision temperature control for MIL-AERO component characterization, testing, and production.
Properly Uncrating a Temperature Forcing System
Watch this video to learn how to properly unpack and un-crate a ThermoStream Temperature Forcing System.
Materials testing often requires a long and narrow cavity to accommodate measurement devices. With tensile testing, objects are pulled in one direction and stressed until failure, but strain can also be used to pull the object in both directions. Customizing chambers for the OEM and end-user is what we do best.
This two-part article, was originally published in Sensors Magazine. In Part 2 we will discuss how cooling capacity and controls affect thermal performance. Part 1 addressed the variables in a test environment and the criteria for matching chamber size to the UUT (Unit Under Test).
This two-part article, originally published in Sensors Magazine, describes engineering considerations for specifying thermal environments to optimize production throughput of temperature-compensated sensors and transmitters. Part I covers chamber configurations, while Part 2 will address thermal environment performance related to heat transfer, uniformity, and controls.
With a remote compressor upgrade kit
ThermoStream models with built-in compressors are great for temperature testing with forced air when no facility air supply is available. The new upgrade kit for ATS-535 and -635 models makes using a ThermoStream in lab and office environments much quieter.
Quickly and Easily Connect Thermal Caps to Temperature Forcing Systems
See the new quick-connect feature for adding a thermal enclosure to Temptronic ThermoStream® systems - nol tools or hardware needed.
The patent-pending, quick-connect feature will be available on all high capacity ThermoStream systems in November, 2015.
A temperature chamber capable of long dwell times and wide temperature ranges (-55 to 500°C) for Electro/Stress Migration, Time Dependent Dielectric Breakdown, and Hot Carrier / Vt Stability Tests.
How to set the bi-metal fail safe
Watch this video to learn how to set the primary over temperature fail safe on a thermal chamber. The chamber's primary fail safe is a bi-metal switch that protects the chamber from run-away or over temperature conditions. If an over temperature condition occurs, the bi-metal fail safe will trip and shut down the chamber's heating and cooling capabilities. It is factory set at 125°C and must be adjusted for the chamber to operate at temperatures above 125°C.
Thermal Plate integrates directly with vacuum bell jar for RF device testing
inTEST Thermal Solutions has designed a thermal cycling plate that integrates directly with a customer’s vacuum bell jar for space and altitude testing of RF modules, microwave components, and high power devices. The wide temperature range and stability of the plate is ideal for both thermal stressing of electronics and long periods of power supply testing.