Client Challenge
A leading technology customer approached InTest Thermal Solutions (ITS) with a unique challenge: they needed to perform temperature testing on a fully socketed Device Under Test (DUT). The socket design, essential for applying even pressure across the DUT’s top surface to ensure consistent pin contact, posed a significant obstacle. This configuration prevented direct access to the DUT’s top side, making it difficult to apply or remove heat effectively during testing.
Collaborative Innovation
After evaluating ITS’s DCP solution through a demonstration, the customer was impressed by both the product and the technical support provided. They expressed interest in collaborating to develop a solution tailored to their specific application.
To overcome the thermal access limitation, the customer introduced ITS to their socket manufacturer. This initiated a three-way collaboration aimed at engineering a custom solution that would:
The Solution
Working closely with the socket manufacturer, ITS co-developed a custom socket lid that preserved the mechanical integrity of the original design while enabling thermal access. This innovative lid allowed the DCP system to efficiently transfer heat to and from the DUT, solving the thermal testing challenge without compromising socket performance.
Results & Impact
Conclusion
This project exemplifies InTest Thermal Solutions’ commitment to collaborative problem-solving and custom engineering. By partnering with socket manufacturers, ITS can deliver tailored thermal forcing solutions for even the most complex applications. This success story highlights the value of cross-industry collaboration in driving innovation and delivering customer-centric solutions.