Two benchtop systems for thermal characterization of ICs, including high-Watt emitting devices, have been introduced by inTEST Thermal. The Temptronic® ThermoSpot® consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible umbilical. The thermal probe is designed with interchangeable thermal heads to mate directly to an IC or other device under test creating a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power.
Interfacing to the DUT is available for in-circuit and test socket applications. Connecting the thermal head to the DUT is made easy and precise through a quick lock-down mechanism on the thermal head.
Two models, DCP-1 and DCP-2, span a temperature range from -65 to 200°C. The DCP-1 provides cooling power of 25W at -40°C for lower power devices, while the DCP-2 provides a capacity to cool 55W at -55°C and 120W at -40°C.
A touch-screen controller permits user-programmable temperatures, graphing, data logging, and more. Using DUT control, with a thermocouple or diode, the system provides fast and precise transitions to temperature at the IC.
For more details see technical data (http://www.intestthermal.com/IC-DUT-conductive-temperature-forcing-DCP) or contact the factory +1.781.688.2300.