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The rapid pace of transceiver design and high volume production demands high efficiency for characterization and tuning. Thermally, it means that devices must reach their programmed temperatures quickly. The ThermoStream® achieves this by creating a stable environment in seconds.
The environmentally friendly ECO series ThermoStream® temperature forcing systems, introduced last year, using less energy with very low audible noise will save users from additional maintenance costs under the EU F-Gas regulation for refrigeration systems. Beginning January 1, 2017, the EU 517/2014 regulation requires annual leak checking for all refrigeration systems that exceed a gas charge limit.
An environmentally friendly series of Temptronic® ThermoStream® temperature forcing systems that use one-third less energy with very low audible noise has been introduced by inTEST Thermal Solutions. The ECO Series temperature test systems operate on a low, 20-amp circuit and incorporate the company’s proprietary WhisperStream™ technology providing quiet, smooth-sounding operation at 56 dBA. The ECO Series is designed with the laboratory environment in mind where audible noise and heat dissipation are of concern.
Two benchtop systems for thermal characterization of ICs, including high-Watt emitting devices, have been introduced by inTEST Thermal. The Temptronic® ThermoSpot® consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible umbilical. The thermal probe is designed with interchangeable thermal heads to mate directly to an IC or other device under test creating a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power.
inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications. The heart of the amplifier is a travelling wave tube (TWT) and power supply. In their space-borne environment, TWTs are exposed to extreme temperatures that influence the strength and stability of their magnetic field and can adversely affect their RF signal output. Rigorous thermal stressing of TWTs is required to characterize RF signal outputs and ensure trouble-free operation after deployment.
The integration of a temperature controlled thermal platform with the Agilent B1506A Power Device Analyzer has been introduced by inTEST Thermal Solutions and Agilent. The newly designed hot plate permits automated control of platform temperature, from enclosure ambient to 250 °C, for characterization of power devices such as IGBTs and MOSFETs.
Power devices generate heat, which is why manufacturers mainly test in high temperature environments. Conventional thermal platforms did not fit within the fixture area of the analyzer, giving rise to inTEST Thermal’s design.
