Thermonics has engineered a low temperature, small footprint chiller for use in the thermal-mechanical extrusion process that devulcanizes and recycles rubber. The chiller’s continuous delivery of sub-cooled liquid carbon dioxide is critical for both the chemical conversion process and the health of integrated components that would fail if gaseous carbon dioxide entered the process.
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This two-part article, was originally published in Sensors Magazine. In Part 2 we will discuss how cooling capacity and controls affect thermal performance. Part 1 addressed the variables in a test environment and the criteria for matching chamber size to the UUT (Unit Under Test).
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This two-part article, originally published in Sensors Magazine, describes engineering considerations for specifying thermal environments to optimize production throughput of temperature-compensated sensors and transmitters. Part I covers chamber configurations, while Part 2 will address thermal environment performance related to heat transfer, uniformity, and controls.
Deciding between a cryogenic and compressor-based cooling engine for your thermal chamber or thermal platform can be difficult. Download this application note to better understand the advantages of each cooling engine and to help decide which one best fits your application.
This bench top system is ideal for conditioning electronics with high volume, low pressure, temperature controlled air. The system delivers up to 43scfm of precisely controlled, clean dry air for conditioning components and instrumentation. It is capable of cycling and holding at temperatures from 20 to 70°C.
Visit Us next week, March 5 thru 7, at The Optical Networking and Communication Conference & Exhibition (OFC2019) in San Diego, CA. We'll be at Booth #4714 with our ThermoSpot® Direct Contact Temperature Forcing System. Stop by and learn how the ThermoSpot can be used for thermal tuning and characterization of optical transceivers.
