Benchtop System for IC Temperature Testing
Two benchtop systems for thermal characterization of ICs, including high-Watt emitting devices, have been introduced by inTEST Thermal. The Temptronic® ThermoSpot® consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible umbilical. The thermal probe is designed with interchangeable thermal heads to mate directly to an IC or other device under test creating a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power.