Click here to download a PDF version of this article.

Click here to view part 2 of this article.

This two-part article, originally published in Sensors Magazine, describes engineering considerations for specifying thermal environments to optimize production throughput of temperature-compensated sensors and transmitters. Part I covers chamber configurations, while Part 2 will address thermal environment performance related to heat transfer, uniformity, and controls.

Pros and cons of cryogenic vs. compressor-based cooling

Deciding between a cryogenic and compressor-based cooling engine for your thermal chamber or thermal platform can be difficult. Download this application note to better understand the advantages of each cooling engine and to help decide which one best fits your application.

For high flow thermal conditioning of electronic modules

This bench top system is ideal for conditioning electronics with high volume, low pressure, temperature controlled air. The system delivers up to 43scfm of precisely controlled, clean dry air for conditioning components and instrumentation. It is capable of cycling and holding at temperatures from 20 to 70°C.

Visit Us next week, March 5 thru 7, at The Optical Networking and Communication Conference & Exhibition (OFC2019) in San Diego, CA. We'll be at Booth #4714 with our ThermoSpot® Direct Contact Temperature Forcing System. Stop by and learn how the ThermoSpot can be used for thermal tuning and characterization of optical transceivers.

These thermal systems provide precision temperature control for MIL-AERO component characterization, testing, and production.

Properly Uncrating a Temperature Forcing System

Watch this video to learn how to properly unpack and un-crate a ThermoStream Temperature Forcing System.

Visit Us  at the Automotive Testing Expo in Novi, MI, Oct. 23 to 25. Booth #11034. Stop by and see our thermal chambers, thermal plates and process chiller.

iTS, manufacturer of the Temptronic® ThermoStream® air forcing system, has developed an enclosure that provides a 55% reduction in the noise caused by forced air during electronics thermal cycling. Electronics testing often requires concentrated air flow to rapidly transition components to specified temperature in a test enclosure. iTS’s new enclosure, called the ECO Quiet Cap connects to the ThermoStream’s air nozzle to reduce the noise and isolate the test subjects.­

Advances in Automotive Chip Testing are creating opportunity for inTEST Thermal's expertise.
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